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Brightflow 210 TDS

SMT Technology Centre,
Prospect Road, Cowes, Isle of Wight,
United Kingdom, PO31 7AD.
Tel:+44 (0)1983 290333 Fax:+44 (0)1983 295499
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Technical Process data – Brightflow 210LF Flux
Brightflow 210LF is a Halide free low solids organic Flux for high temperature lead free wave soldering
on both surface mount and through hole applications. It is suitable for all common alloys, and gives
superior wetting with bright solder joints. It conforms to all no clean class requirements, and does not
degrade by reduction of surface insulation resistance on soldered assemblies. If required, Brightflow 210LF
can be cleaned, in localized areas by Hydrocarbon solvents, or by offline cleaning in Aqueous chemistries,
preferably with buffered Alkali Saponification and typically a PH of 11, and heated to @ 60 deg. C.
Flux Classification Data
Specification Test standard
Flux Class ORL0 IPC-J-STD-004B
Colour & Appearance Clear Liquid
Copper Mirror Pass IPC-TM-650 2.3.32
SIR 2.1312 x 10 Ohms IPC-TM-650
Specific Gravity (g/cm3) 0.811 + 0.006
Solids Content % VW 3.0 + 0.5
Acid Number (mgKOH/g) 40.0 – 50.0 By Titration
Process Control
Spray flux application method
If the flux is applied by spray method, flux monitoring and control is not required as it is a total loss system
and is constantly replenished with as manufactured specification flux.
Foam flux application method
If the flux application is by the older bubble foam type applicator, repeatable and accurate flux deposition on the PCB will require monitoring and control of the flux. Because this flux is a very low solids content type, traditional specific gravity measurement is not accurate enough for the assessment of solids %, and testing for the total acid number by Titration, and adjustment with Isosolve thinners is the recommended method for maintenance of the correct flux concentration. Foam type fluxer units will require periodic removal of debris and other contaminants from the reservoir, and replacement of the flux. It is recommended that this is done
every 30 – 40 hours of soldering operation.
Process Methods
For production wave soldering of HASL or bare copper PCB boards, 210LF can be applied by spray or foam
fluxer systems. Foam type fluxers should be supplied with dry oil free air, and the flux reservoir should be
kept topped up. Flux surface should be 25 – 30 mm above the foamer stone/aerator. In either application
method, an air knife can be beneficial in removing excess flux, though with the spray method, adjustment for
consistant coating is more finely and easily achieved by time and pressure adjustment. Uniformity of the spray flux coating can be assessed by running a tempered glass test plate throught the spray fluxer and
preheat zones, and then visually inspecting prior to transit into the solder wave zone.
Typical Process Parameters
Parameter Typical Parameter Level
Amount of Flux Spray application: 750 – 1500 ug/in2 solids
Amount of Flux Foam application: 1000 – 2000 ug/in2 solids
Foam Fluxer Parameters:
Foam Stone Pore Size 20 – 50 um.
Flux Level Above Stone 25 – 35 mm
Vent opening 10 – 13 mm
Inlet Air Pressure 1 – 2 P.S.I.
Top Side Preheat Temperature 85 – 110 deg. C.
Bottom Side Preheat Temperature Selected Top Side Temperature + 35 deg. C.
Conveyer Speed (depends on length) Typical Range 1200 – 1800 mm per minute.
Contact Time in Solder Wave 2.5 – 4.5 Seconds
Solder Pot Temperatures (by alloy)
Sn 96.5 / Ag 3.5 260 – 276 deg. C
Sn 95 / Ag 5 280 – 296 deg. C.
Sn 99.3 / Cu 0.7 265 – 276 deg. C.
Sn / Ag / Cu 271 – 276 deg. C.
Sn 95 / Sb 5 280 – 296 deg. C.
SN100C (Nihon Superior) 260 – 275 deg. C.
Storage and Shelf Life
210LF should be stored in the supply container within a cool dry environment, and held within the
temperature range 18 – 26 deg. C. Shelf life is two years from date of manufacture.
210LF contains some hazardous ingredients, and if required to be disposed of, must be done
so in accordance with local and national regulations within the country of use.
Data sheet : V1.1 20/09/2020.

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