Process Monitoring

Featured, Process Monitoring

The long established and highly successful SMT USC400 on contact Ultrasonic Stencil Cleaning System has been upgraded to give a higher Transducer power output in order to support enhanced cleaning of ultra fine pitch Solder Paste residues from conventional and Pump Print type Stencils

 

Newer generation class 4, 5, and latterly class 6 and 7 Solder particle sizes can be difficult to remove when trapped in the corners of small Stencil apertures, even when cleaned in high performance offline cleaning systems. In addition UFP Stencils are more likely to clog and cause image resolution issues during Stencil Printing operations. The SMT USC400 can be used on the Printer to clear apertures without removing the Stencil, and thereby avoiding the need to reset the Printer parameters. The USC400 advanced frequency auto tune system means that unlike competing systems, no low frequency vibration is applied to the Stencil, and maximum Transducer output power is always available as the cleaning head is moved over the surface of the Stencil. The USC400 is ideally suited to cleaning of Mesh mounted legacy Stencils as risk of damage to the metal foil attachment Adhesive area is minimized. It is particularly effective when partnered with Surclean SC100, SC400, and the latest Surclean SC3003 cleaning Chemistries.     

Showing 85–87 of 112 results

Process Support

Featured, Process Support

The long established and highly successful SMT USC400 on contact Ultrasonic Stencil Cleaning System has been upgraded to give a higher Transducer power output in order to support enhanced cleaning of ultra fine pitch Solder Paste residues from conventional and Pump Print type Stencils

 

Newer generation class 4, 5, and latterly class 6 and 7 Solder particle sizes can be difficult to remove when trapped in the corners of small Stencil apertures, even when cleaned in high performance offline cleaning systems. In addition UFP Stencils are more likely to clog and cause image resolution issues during Stencil Printing operations. The SMT USC400 can be used on the Printer to clear apertures without removing the Stencil, and thereby avoiding the need to reset the Printer parameters. The USC400 advanced frequency auto tune system means that unlike competing systems, no low frequency vibration is applied to the Stencil, and maximum Transducer output power is always available as the cleaning head is moved over the surface of the Stencil. The USC400 is ideally suited to cleaning of Mesh mounted legacy Stencils as risk of damage to the metal foil attachment Adhesive area is minimized. It is particularly effective when partnered with Surclean SC100, SC400, and the latest Surclean SC3003 cleaning Chemistries.     

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Soldering

Featured, Soldering

High quality Soldered joints between components and the PCB contact points are key to assembly quality.

Surclean distribute and support a range of Soldering materials sourced from some of the leading manufacturers around the world, including Industry leading SN100C patented solder alloy in its latest version from Nihon Superior (Japan).

Materials for all Soldering methods are available from manual Soldering operations, SMT Reflow, and wire dip, through to Selective and Wave automatic processes.

Surclean also manufacture and supply our own Solder Fluxes covering legacy types up to the latest pure synthetic no-clean types, all qualified to IPC and Bellcore standards in our own Test facility. This backed up by our Laboratory test and Solder defect analysis capabilities for customer support.

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PCB Cleaning

Featured, PCB Cleaning

Increasing PCBA complexity reductions in track size has meant increased demand for removal of Flux residues, resins, and process related contamination from PCB assemblies, Hybrids and Power Control Modules.

Technology integrators in many Industry sectors now require cleaning of assemblies from suppliers to IPC and J-STD standards for added service reliability, particularly if Conformal Coating has been specified.

Surclean Chemistries cover all types of cleaning process from safer Solvent, Semi Aqueous, and fully Aqueous, and all methods from bench top manual cleaning operations right through to large volume automatic offline cleaning systems

Showing 85–87 of 112 results